COOLING UNIT FOR SEMICONDUCTOR ELEMENT

PURPOSE:To reduce the size of a cooling unit and its cost, by making the wiring inductance between a power semiconductor element and its driving apparatus small, and by securing the rate of the current change necessary for driving the semiconductor element. CONSTITUTION:In a cooling unit for semicon...

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Main Authors KINOSHITA SHIGENORI, SHIBUYA SUSUMU, YANO KAZUHIRO, YOSHIKAWA HARUKI, UMETSU KAZUYOSHI, ISHIZU KAZUMASA, INETAMA SATORU
Format Patent
LanguageEnglish
Published 11.03.1994
Edition5
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To reduce the size of a cooling unit and its cost, by making the wiring inductance between a power semiconductor element and its driving apparatus small, and by securing the rate of the current change necessary for driving the semiconductor element. CONSTITUTION:In a cooling unit for semiconductor elements, power semiconductor elements such as GTO thyristors 301, whereby a power converting equipment is configured, are dipped in a cooling tank 1 filled with a refrigerant. In the cooling unit, gate driving units 5' for driving the thyristors 301 are boused in the cooling tank 1. Also, if necessary, a gate power supply apparatus 6 is boused in the cooling tank 1 too.
Bibliography:Application Number: JP19920245768