SEMICONDUCTOR DEVICE

PURPOSE:To provide a higher speed and density semiconductor device of plastic sealed package structure. CONSTITUTION:For a lead 12, which connects a semiconductor chip 11 with an external circuit board 31, one end is connected to the power source connecting pad of the semiconductor chip 11, and the...

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Bibliographic Details
Main Authors YONEDA YOSHIYUKI, SAKOTA EIJI, TSUJI KAZUTO
Format Patent
LanguageEnglish
Published 25.02.1994
Edition5
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To provide a higher speed and density semiconductor device of plastic sealed package structure. CONSTITUTION:For a lead 12, which connects a semiconductor chip 11 with an external circuit board 31, one end is connected to the power source connecting pad of the semiconductor chip 11, and the other end is connected to the external circuit board 31. In addition to the semiconductor chip 11 and the lead 12, this device comprises a substrate 13, where a conductive part (composed of a power source or earth patterns 18-20 and connection patterns, vias 24-26) for connecting the semiconductor chip 11 with the external circuit board 31 is formed separately from the lead 12, and a resin package 14 for sealing the semiconductor chip 11 and the substrate 13.
Bibliography:Application Number: JP19920336369