MULTILAYER PRINTED WIRING BOARD

PURPOSE:To increase the reliability of a multilayer printed wiring board by ensuring the nonconductive state between through holes for connecting conductor pattern formed in different layers, and an inner-layer power source layer or grounding layer. CONSTITUTION:A multilayer printed wiring board is...

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Bibliographic Details
Main Authors DEMURA AKIHIRO, ITO SATORU
Format Patent
LanguageEnglish
Published 10.02.1994
Edition5
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PURPOSE:To increase the reliability of a multilayer printed wiring board by ensuring the nonconductive state between through holes for connecting conductor pattern formed in different layers, and an inner-layer power source layer or grounding layer. CONSTITUTION:A multilayer printed wiring board is provided with an inner layer having power source surfaces 3a and 3b of a grounding surface 4. And circular clearances 6 for through holes are formed in the power source surface 3a and 3b or a grounding surface 4. When two clearances 6, or a clearance 6 and an isolating pattern 5 exist touching each other, the shape of the clearances 6 is corrected so that the exterior angle formed by the outline of a conductor layer existing between the clearances 6 adjoining, or between the clearance 6 and the isolating pattern 5 may be a right angle or more.
Bibliography:Application Number: JP19920185485