MULTILAYER CIRCUIT BOARD AND COOLING METHOD THEREOF

PURPOSE:To improve the mounting density and the cooling efficiency relative to an MCM (Multichip Module) and reduce its size. CONSTITUTION:On a multilayer circuit board 1, a plurality of LSI chips 4 are mounted in a three-dimensional way. In a thin film circuit provided on the surface, of the board...

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Bibliographic Details
Main Authors KAMEZAKI HIROSHI, IMANAKA YOSHIHIKO
Format Patent
LanguageEnglish
Published 10.02.1994
Edition5
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To improve the mounting density and the cooling efficiency relative to an MCM (Multichip Module) and reduce its size. CONSTITUTION:On a multilayer circuit board 1, a plurality of LSI chips 4 are mounted in a three-dimensional way. In a thin film circuit provided on the surface, of the board 1, a thin film part 3 is formed, and the thin film part 3 has an insulation layer, a conductor layer, a resistor layer and a capacitor layer, out of which resistors and capacitors are formed respectively. In the board 1, conductors piercing it are provided, and on the rear surface of the board 1, I/O pads 5 connected with the conductors are formed. Further, the multilayer circuit board 1 is so configured that it is cooled by contacting a liquid with it.
Bibliography:Application Number: JP19920192447