PRINTED WIRING BOARD

• Main Authors: DEMURA AKIHIRO, NOHARA TORU
• Format: Patent
• Language: English
• Published: 02.12.1994
• Edition: 5
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PURPOSE:To prevent the sagging of bonding wires electrically connecting the pads of electronic components with pads arranged in zigzag with a simple constitution. CONSTITUTION:Pads 4 to be connected electrically to an IC chip 5 by wiring bonding are arranged in zigzag around an electronic components mounting section 3 and the lengths of the inside pads 4a closer to the section 3 are made longer than those of the outside pads 4b farther from the section 3. When such a constitution is used, the outside pads 4b can be brought nearer to the section 3. Therefore, the lengths and weights of the bonding wires 6 connected to the pads 4b are reduced and the sagging of the wires 6 can be prevented with such a simple constitution without using any special members.