PRINTED WIRING BOARD

PURPOSE:To prevent the sagging of bonding wires electrically connecting the pads of electronic components with pads arranged in zigzag with a simple constitution. CONSTITUTION:Pads 4 to be connected electrically to an IC chip 5 by wiring bonding are arranged in zigzag around an electronic components...

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Bibliographic Details
Main Authors DEMURA AKIHIRO, NOHARA TORU
Format Patent
LanguageEnglish
Published 02.12.1994
Edition5
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To prevent the sagging of bonding wires electrically connecting the pads of electronic components with pads arranged in zigzag with a simple constitution. CONSTITUTION:Pads 4 to be connected electrically to an IC chip 5 by wiring bonding are arranged in zigzag around an electronic components mounting section 3 and the lengths of the inside pads 4a closer to the section 3 are made longer than those of the outside pads 4b farther from the section 3. When such a constitution is used, the outside pads 4b can be brought nearer to the section 3. Therefore, the lengths and weights of the bonding wires 6 connected to the pads 4b are reduced and the sagging of the wires 6 can be prevented with such a simple constitution without using any special members.
Bibliography:Application Number: JP19930118758