SEMICONDUCTOR DEVICE

PURPOSE:To provide a technique capable of increasing the reliability of hermetic sealing of a package, and preventing the lowering or malfunction of the circuit performance of a semiconductor device. CONSTITUTION:A stepped part 2e is provided at the jointing part 2d of at least one of a base 2 and a...

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Bibliographic Details
Main Authors FUSE MAKOTO, MIZUNO CHIYOUICHIROU
Format Patent
LanguageEnglish
Published 04.11.1994
Edition5
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To provide a technique capable of increasing the reliability of hermetic sealing of a package, and preventing the lowering or malfunction of the circuit performance of a semiconductor device. CONSTITUTION:A stepped part 2e is provided at the jointing part 2d of at least one of a base 2 and a cap 4 forming a package, and jointing is performed. Or, the external surface of a jointing material 5 such as solder, etc., for jointing the base and the cap is coated hermetically by nickel plating, etc. As a result, the junction surface is bent by the stepped part, and solder shrinking holes produced are prevented from extending by the bent part of the junction surface. Consequently, they do not penetrate the jointing material, and the reliability of the hermetic sealing can be raised. Or, the outside air is prevented from entering the package, by coating the external surface of the jointing material by nickel plating, etc., and covering the solder shrinking holes. Consequently, the reliability of the hermetic sealing can be raised.
Bibliography:Application Number: JP19930093236