FIXING METHOD FOR LEAD FRAME PIN

PURPOSE:To improve heat resistance, by fusing aromatic thermoplastic polyimide material and fixing it. CONSTITUTION:Lead frame pins 2 of a 42 nickel plate are put on a heat plate whose temperature is kept at 220 deg.C. After a thermoplastic polyimide film of 1.5mm in width and 50mum in thickness is...

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Bibliographic Details
Main Authors KUDO SHOEI, MINETA NAOSHI
Format Patent
LanguageEnglish
Published 21.10.1994
Edition5
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To improve heat resistance, by fusing aromatic thermoplastic polyimide material and fixing it. CONSTITUTION:Lead frame pins 2 of a 42 nickel plate are put on a heat plate whose temperature is kept at 220 deg.C. After a thermoplastic polyimide film of 1.5mm in width and 50mum in thickness is put on the pins, the film is irradiated with far infrared rays from a lamp, and heated and fused at about 450 deg.C. Thus the film is fusion-bonded to the lead frame pins 2. After cooling at a room temperature, the 90 deg. bonding strength between the 42 nickel plate lead frame pin 2 and the thermoplastic polyimide film 1 is measured, and the average value of 0.6kg/cm is obtained. Each material maintains excellent appearance, and disturbance of pins can not be recognized. The aromatic thermoplastic polyimide material is buried in the part between the pins, without thickening the upper parts of the lead frame pins, so that strength, gaps, and insulation can be ensured.
Bibliography:Application Number: JP19930083580