TARGET MATERIAL FOR PRODUCING THIN HIGH DIELECTRIC FILM AND ITS PRODUCTION

• Main Authors: SUGIHARA TADASHI, OUCHI YUKIHIRO
• Format: Patent
• Language: English
• Published: 20.09.1994
• Edition: 5
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PURPOSE:To produce a thin dielectric film by DC sputtering by using a target material having a structure contg. specified composite coated particles uniformly dispersed in the metal Ti matrix. CONSTITUTION:A titanic acid compd. of Ba and Sr obtd. by firing is pulverized to form powder, this powder is mixed with powder Ti or a mixture of powdery Ti with powdery TiO2 and the resulting mixture is hot-pressed in vacuum to produce the objective target material having a structure contg. composite coated particles uniformly dispersed in the metal Ti matrix. Each of the coated particles consists of the titanic acid compd. of Ba and Sr and titanium oxide [TiO2-z (0<=z<=2)] enclosing the compd. When the target material is used, a thin dielectric film ensuring a low leakage current and having a high dielectric constant can be produced.