HOT-WATER EXTRACTION JIG FOR WAFER

• Main Authors: TAKASUKA MASAMI, MUKAI TOSHIO
• Format: Patent
• Language: English
• Published: 09.09.1994
• Edition: 5
• Subjects: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MEASURING; PERFORMING OPERATIONS; PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL; PHYSICS; SEPARATION; TESTING; TRANSPORTING

PURPOSE:To reduce the required amount of an extraction liquid to a minimum by a method wherein the title jig is constituted of a back-type container for a semiconductor wafer, of a first ring and a second ring which are opened partly and of a third ring which is not provided with an opening and the interleaving amount of the container is adjusted by the first and second rings. CONSTITUTION:A back-type container 2 is put on a first ring 3, and an opening part in the container 2 is set to the same direction as an opening part 4 in the ring 3. Then, a wafer 1 for analysis is put into the container 2 in such a way that it is situated in the center of the ring 3. Then, an opening part 6 in a second ring 5 is made to coincide with the opening part 4 on the container 2, the ring 3 is overlapped with the ring 5 so as to be fitted to the inside, the ring is pressurized from the upper part, and the rings 3, 5 are fitted. When an amount by which the container 2 is interleaved with the rings 3, 5 is adjusted, the amount of an extraction liquid 8 inside the container 2 can be adjusted. Then, the extraction liquid 8 is injected into the container 2, a third ring 7 is fitted to the ring 5, and hot water is extracted. By this method, a liquid amount by which the wafer 1 comes into perfect contact with the extraction liquid 8 can be reduced to a minimum.