PACKAGING METHOD OF SEMICONDUCTOR CHIP

PURPOSE:To prevent a printed board from warping during reflow step. CONSTITUTION:A warp correcting jig 11 formed of a square type stainless steel is mounted on a printed board 2 as if encircling a semiconductor chip 1 tacked on the printed board 2. Through these procedures, the printed board 2 is fi...

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Bibliographic Details
Main Author RAI AKITERU
Format Patent
LanguageEnglish
Published 02.09.1994
Edition5
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To prevent a printed board from warping during reflow step. CONSTITUTION:A warp correcting jig 11 formed of a square type stainless steel is mounted on a printed board 2 as if encircling a semiconductor chip 1 tacked on the printed board 2. Through these procedures, the printed board 2 is fixed by the weight of the correcting jig 11 so that the printed board 2 may be prevented from warping due to the heat generated during reflowing step.
Bibliography:Application Number: JP19930029046