METHOD OF WASHING

PURPOSE:To make it possible to sufficiently remove particles without damaging parts of semiconductor devices such as wiring made of Al. CONSTITUTION:A semiconductor wafer 8 to be washed is arranged between a electrode 3 and an electrode 4 both facing to each other in a solute 7, and alternating curr...

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Bibliographic Details
Main Authors HORIE HIROSHI, MIYATA NORIYUKI, KISHII SADAHIRO, SATO YASUHISA
Format Patent
LanguageEnglish
Published 19.08.1994
Edition5
Subjects
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