METHOD OF WASHING
PURPOSE:To make it possible to sufficiently remove particles without damaging parts of semiconductor devices such as wiring made of Al. CONSTITUTION:A semiconductor wafer 8 to be washed is arranged between a electrode 3 and an electrode 4 both facing to each other in a solute 7, and alternating curr...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
19.08.1994
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Edition | 5 |
Subjects | |
Online Access | Get full text |
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Summary: | PURPOSE:To make it possible to sufficiently remove particles without damaging parts of semiconductor devices such as wiring made of Al. CONSTITUTION:A semiconductor wafer 8 to be washed is arranged between a electrode 3 and an electrode 4 both facing to each other in a solute 7, and alternating current is applied between the electrode 3 and the electrode 4 from a power supply 6 to apply alternating electric field to the semiconductor wafer 8 so as to remove the static electricity of particles. At the same time, an oscillating circuit and a piezoelectric transducer within a vibration container 2 operated to conduct ultrasonic washing. |
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Bibliography: | Application Number: JP19930014457 |