METHOD OF WASHING

PURPOSE:To make it possible to sufficiently remove particles without damaging parts of semiconductor devices such as wiring made of Al. CONSTITUTION:A semiconductor wafer 8 to be washed is arranged between a electrode 3 and an electrode 4 both facing to each other in a solute 7, and alternating curr...

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Bibliographic Details
Main Authors HORIE HIROSHI, MIYATA NORIYUKI, KISHII SADAHIRO, SATO YASUHISA
Format Patent
LanguageEnglish
Published 19.08.1994
Edition5
Subjects
BASIC ELECTRIC ELEMENTS
CLEANING
CLEANING IN GENERAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
PREVENTION OF FOULING IN GENERAL
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:PURPOSE:To make it possible to sufficiently remove particles without damaging parts of semiconductor devices such as wiring made of Al. CONSTITUTION:A semiconductor wafer 8 to be washed is arranged between a electrode 3 and an electrode 4 both facing to each other in a solute 7, and alternating current is applied between the electrode 3 and the electrode 4 from a power supply 6 to apply alternating electric field to the semiconductor wafer 8 so as to remove the static electricity of particles. At the same time, an oscillating circuit and a piezoelectric transducer within a vibration container 2 operated to conduct ultrasonic washing.
Bibliography:Application Number: JP19930014457