MULTILAYER INTERCONNECTION STRUCTURE AND ITS FORMATION

PURPOSE:To eliminate the factors hindering the high density in a multilayer interconnection construction and provide the multilayer interconnection construc tion and its formation method to realize the high density by dispersing through- holes for connecting respective wirings in a first and second...

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Bibliographic Details
Main Author KONDO MAMORU
Format Patent
LanguageEnglish
Published 05.08.1994
Edition5
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To eliminate the factors hindering the high density in a multilayer interconnection construction and provide the multilayer interconnection construc tion and its formation method to realize the high density by dispersing through- holes for connecting respective wirings in a first and second wiring layers. CONSTITUTION:The wirings 11 to 17 for connecting chips 1 and 2 and the wirings 41 to 47 connected with a chip 3 are connected with wirings 21 to 27 through through-holes 31 to 37 and 51 to 57, and the connection among the chips 1 to 3 is carried out in the same order in a manner that the through-holes may not be adjoined each other obliquely, further a through-hole pattern is designed to arrange any one wiring between an optional through-hole and a through-hole adjoining to the periphery.
Bibliography:Application Number: JP19930007409