METHOD OF ANALYZING HEATING TEMPERATURE OF PRINTED WIRING BOARD AND THE LIKE

PURPOSE:To enable reduction of the number of meshes for analysis to be generated and the number of regions to be analyzed, by computing the quantity of heating of a region to be evaluated which is surrounded by the meshes for analysis, on the assumption that the quantity of heating distributed unifo...

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Bibliographic Details
Main Authors KAIZU KATSUMI, KISHIMOTO TORU
Format Patent
LanguageEnglish
Published 26.07.1994
Edition5
Subjects
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
MEASURING
MEASURING QUANTITY OF HEAT
MEASURING TEMPERATURE
PHYSICS
TESTING
THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
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Summary:PURPOSE:To enable reduction of the number of meshes for analysis to be generated and the number of regions to be analyzed, by computing the quantity of heating of a region to be evaluated which is surrounded by the meshes for analysis, on the assumption that the quantity of heating distributed uniformly exists in a region not to be evaluated. CONSTITUTION:Regions 2b and 2c to be analyzed are set. Next, the total sum of the quantity of heating of a heating region not to be analyzed is determined and divided by the area obtained by subtracting the area of the regions 2b and 2c from the area of a printed wiring board 1, so as to determine the quantity of heating for a unit area. Subsequently, meshes 3 for analysis for the regions 2b and 2c are generated. Then, the region other than the regions 2b and 2c surrounded by the meshes 3 is multiplied by the quantity of heating for the unit area and the result is made the quantity of heating of that region. In this way, the number of meshes for analysis and that of regions to be analyzed can be reduced.
Bibliography:Application Number: JP19920029177