SEMICONDUCTOR DEVICE

PURPOSE:To provide a semiconductor device which has excellent electrical characteristics and which enables reduction of grounding inductance by shortening the length of a grounding wire. CONSTITUTION:A pair of receiving boards formed by bending them into a bridge shape are provided. Base parts 7a of...

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Bibliographic Details
Main Author OGATA TOSHIICHI
Format Patent
LanguageEnglish
Published 28.06.1994
Edition5
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To provide a semiconductor device which has excellent electrical characteristics and which enables reduction of grounding inductance by shortening the length of a grounding wire. CONSTITUTION:A pair of receiving boards formed by bending them into a bridge shape are provided. Base parts 7a of these receiving boards 7 are fixed to grounding part 2c and the front parts are arranged near and above a transistor chip 5 so that the front parts hold the transistor chip 5 mounted on a die pad 2a from both sides. Electrode pads of the transistor chip 5 and the front parts of receiving boards 7 are connected to each other with grounding wires 6a. Then, the connecting distance between the transistor chip and a grounding pattern becomes shorter and a grounding inductance by the wire can be reduced, resulting in improvement in electrical characteristics of the semiconductor device.
Bibliography:Application Number: JP19920354576