SURFACE CLEANING AGENT FOR COPPER AND COPPER ALLOY

• Main Authors: ISHIZUKA YOSHITSUGU, TAKAHATA TADAO, TAKASE YUZO
• Format: Patent
• Language: English
• Published: 25.01.1994
• Edition: 5
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25; NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE

PURPOSE:To rapidly clean the surface of copper and copper alloy by constituting the surface cleaning agent of an aq. soln. of water-soluble alkanol amine and potassium permanganate. CONSTITUTION:The surface cleaning agent for the copper and copper alloy is constituted of the aq. soln. of the water-soluble alkanol amine and the potassium permanganate and/or sodium permanganate. The water-soluble alkanol amine to be used is exemplified by monoethanol amine, diethanol amine, triisopropanol amine, etc. Further, the water-soluble alkanol amine is exemplified by the adduct of the ethylene oxide or/and propylene oxide of ethylene diamine or the diethylene triamine. The concn. of the potassium permanganate and/or the sodium permanganate is preferably 0.1 to 5wt.%. By this, the surface after the etching is cleaned and the degradation of working environment by stimulative smells is obviated.