CIRCUIT BOARD IN WHICH HEAT PIPE IS EMBEDDED

PURPOSE:To enhance the heat conductive property of a circuit board in which heat pipe is embedded and on which components generating much heat such as semiconductor device are mounted and to enhance the cooling effiiciency of the circuit board. CONSTITUTION:A circuit board 11 in which heat pipe is e...

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Bibliographic Details
Main Authors YAMAMORI KAZUYUKI, KOBAYASHI KENZO, YAMAMOTO MASAAKI
Format Patent
LanguageEnglish
Published 31.05.1994
Edition5
Subjects
BLASTING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HEAT EXCHANGE IN GENERAL
HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
HEATING
LIGHTING
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MECHANICAL ENGINEERING
PRINTED CIRCUITS
WEAPONS
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Summary:PURPOSE:To enhance the heat conductive property of a circuit board in which heat pipe is embedded and on which components generating much heat such as semiconductor device are mounted and to enhance the cooling effiiciency of the circuit board. CONSTITUTION:A circuit board 11 in which heat pipe is embedded is formed by burying the heat-absorbing part of flat heat pipes 17 inside a board 18 provided with circuit patterns 12 on the surface. In the circuit board, hollows 30 are formed in the heat pipe contact face of a heat-dissipating plate 19 arranged inside the circuit board.
Bibliography:Application Number: JP19920324891