BRAZING FILLER METAL FOR LEAD PIN

PURPOSE:To assure the uniform height of lead pins without the irregularity thereof by preparing the brazing filler metal for lead pins contg. Au in a specific range and consisting of the balance Sn. CONSTITUTION:This brazing filler metal 5 for lead pins consists of 78 to 79.5% Au and the balance Sn....

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Bibliographic Details
Main Author IWAI SHOZABURO
Format Patent
LanguageEnglish
Published 10.05.1994
Edition5
Subjects
BASIC ELECTRIC ELEMENTS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:PURPOSE:To assure the uniform height of lead pins without the irregularity thereof by preparing the brazing filler metal for lead pins contg. Au in a specific range and consisting of the balance Sn. CONSTITUTION:This brazing filler metal 5 for lead pins consists of 78 to 79.5% Au and the balance Sn. The brazing filler metal 5 for lead pins having such component compsn. is mostly the eutectic structure of the Au and the Sn and slightly Sn-rich crystals appear therein but the Sn rich crystals are fine and, therefore, the irregularity in the height at the time of brazing the lead pins 1 does not arise. Substrates or the lead pins, etc., are often subjected to Au plating in order to improve brazer flow or to improve reliability. The Au of the Au plating component is taken in to form the AuSn eutectic structure at the time of soldering even if the brazing filler metal 5 for lead pins has the Sn-rich crystals and, therefore, there are no troubles at all.
Bibliography:Application Number: JP19920306046