APPARATUS AND METHOD OF POLISHING

• Main Authors: ARIMOTO YOSHIHIRO, KISHII SADAHIRO
• Format: Patent
• Language: English
• Published: 28.04.1994
• Edition: 5
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PURPOSE:To provide an apparatus for uniformly polishing the wafer surface, on which interconnections covered with insulator are formed, without observing the polished surface of a wafer during a polishing. CONSTITUTION:A polishing apparatus comprises a polishing member 21 in which a polishing cloth...