APPARATUS AND METHOD OF POLISHING

PURPOSE:To provide an apparatus for uniformly polishing the wafer surface, on which interconnections covered with insulator are formed, without observing the polished surface of a wafer during a polishing. CONSTITUTION:A polishing apparatus comprises a polishing member 21 in which a polishing cloth...

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Bibliographic Details
Main Authors ARIMOTO YOSHIHIRO, KISHII SADAHIRO
Format Patent
LanguageEnglish
Published 28.04.1994
Edition5
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To provide an apparatus for uniformly polishing the wafer surface, on which interconnections covered with insulator are formed, without observing the polished surface of a wafer during a polishing. CONSTITUTION:A polishing apparatus comprises a polishing member 21 in which a polishing cloth 22 is formed on a surface in contact with a wafer to be polished and a plurality of through holes 23a and 23b into which a polishing agent passes are formed, and a wafer holding member for holding the polished wafer on which a conductor layer and an insulating film coating the conductor layer are formed. Then, electrodes 24a and 24b in which the polishing agent passes into at least two or more through holes 23a and 23b out of a plurality of the through holes 23a and 23b are provided, and current detecting means 25 and a power source 26 are connected in series between a pair of the electrodes 24a and 24b, and the polishing agent contains ions.
Bibliography:Application Number: JP19920270438