CATALYST LIQUID SELECTIVE OF COPPER-BASE MATERIAL FOR ELECTROLESS PLATING

• Main Authors: HAGA MASAKI, OKADA TAKASHI, UCHIDA HIROKO, UCHIDA MAMORU
• Format: Patent
• Language: English
• Published: 12.04.1994
• Edition: 5
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PURPOSE:To obtain a catalyst liquid for electroless plating which can selectively give catalytic activity to only a copper-base material and is advantageous in terms of cost by constituting the liquid of an aq. soln. containing specified amts. of nickel compd. or cobalt compd. and thioureas. CONSTITUTION:This catalyst liquid for electroless plating for selective plating of copper-base material contains at least one of nickel compd. and cobalt compd. by 0.001-3mol/l, preferably 0.01-1.5mol/l, and at least one kind of thiourea by 0.05-5mol/l, preferably 0.5-3mol/l, and if necessary, various chelating agents are compounded into the liquid. This liquid prevents skipping, bridging, etc. When a body to be plated containing copper-base material is subjected to electroless plating, the body to be treated is dipped in the catalyst liquid at 10-90 deg.C for 10sec to 10min, and then brought into contact with an electroless plating bath. Thus, only the copper base material can be selectively plated.