SEMICONDUCTOR INTEGRATED CIRCUIT

PURPOSE:To enlarge an area which is closely adhered to a bonding wire and to restrain peeling of the bonding wire by forming a cross section contour of a bonding pad to a recessed shape. CONSTITUTION:A recessed bonding pad 4 consisting of aluminum, etc., is formed on a silicon substrate 1 through a...

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Bibliographic Details
Main Author KATO AKITOSHI
Format Patent
LanguageEnglish
Published 09.04.1993
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To enlarge an area which is closely adhered to a bonding wire and to restrain peeling of the bonding wire by forming a cross section contour of a bonding pad to a recessed shape. CONSTITUTION:A recessed bonding pad 4 consisting of aluminum, etc., is formed on a silicon substrate 1 through a silicon oxide film 2. A passivation film 3 which consists of a nitride film, etc., is formed in an area excepting a part wherein the bonding pad 4 and a bonding wire 5 adhere closely to each other. Since a cross sectional contour of the bonding pad 4 formed in this way is made a recessed shape, a contact area with the bonding wire 5 is enlarged. Therefore, even if corrosion is generated in the bonding pad 4 due to water, peeling of the bonding wire 5 can be restrained.
Bibliography:Application Number: JP19910248684