MANUFACTURE OF WIRING BOARD

• Main Authors: NAKASO AKISHI, OTSUKA KAZUHISA, HATAKEYAMA SHUICHI, KIDA AKINARI, URASAKI NAOYUKI
• Format: Patent
• Language: English
• Published: 26.03.1993
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PURPOSE:To prevent line discontinuity and line rising by forming a nickel layer and a copper layer on a substrate surface one by one, by oxidizing a surface of the copper layer thereafter and by forming a resist image on the surface of the copper layer wherein copper oxide is formed or by forming a resist image on a copper layer surface which is acquired by reducing copper oxide to copper. CONSTITUTION:A copper oxide layer 2 is formed on one side of a copper foil 1 by using treatment solution. An insulating base material 3 is arranged in contact with a surface of the copper foil wherein copper oxide is formed, and a lamination structure body is formed by heating and pressurizing. After a through-hole 4 is provided, the copper foil and the copper oxide layer are chemically removed. The structure body is immersed in electroless nickel plating solution and a nickel plating layer 5 is formed. A copper plating layer 6 is formed on a nickel surface using displacement copper plating solution. Thereafter, a copper oxide layer 7 is formed on a surface of the copper plating layer. The copper oxide layer 7 is immersed in reduction treatment solution and the copper oxide layer 7 is reduced to a metallic copper layer 8. A resist image 9 is formed on a surface of the metallic copper layer 8.