MANUFACTURE OF FLEXIBLE PRINTED WIRING BOARD FITTED WITH COVERLAY FILM

• Main Authors: NOMURA HIROSHI, NAGAO KOICHI, KATO YASUSHI, SATO EIKICHI, SUZUKI MASAKATSU, IMAIZUMI JUNICHI, OCHI TAKAHITO
• Format: Patent
• Language: English
• Published: 14.01.1993
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; BASIC ELECTRIC ELEMENTS; CABLES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; CONDUCTORS; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; INSULATORS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PERFORMING OPERATIONS; POLISHES; PRINTED CIRCUITS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF MATERIALS AS ADHESIVES; WORKING-UP

PURPOSE:To provide a flexible printed wiring board fitted with a coverlay film, which is excellent in its thermal resistance to soldering and in its resistibility to curling. CONSTITUTION:To both the surfaces of a polyimide film, whose one side is subjected to a plasma processing, applied is a bonding agent made of a polyimide resin or the precursor thereof, and the bonding agent is dried. Then, after the conductor circuit surface of a flexible printed wiring board is thermocompression-bonded to the surface subjected to the plasma processing, the bonding agent on the opposite surface of the polyimide film to the surface subjected to the plasma processing is peeled and is removed.