METHOD FOR FORMING ACUTE-ANGLE STRUCTURE

PURPOSE:To provide the method which can form a thin-film pattern having an acute angle like a needle with high accuracy. CONSTITUTION:A layer 102 to be etched which is formed on a substrate 101 is coated with a photoresist layer 103, which is irradiated with light in 1st pattern consisting of the bo...

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Bibliographic Details
Main Author AOKI MASAKANE
Format Patent
LanguageEnglish
Published 19.03.1993
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To provide the method which can form a thin-film pattern having an acute angle like a needle with high accuracy. CONSTITUTION:A layer 102 to be etched which is formed on a substrate 101 is coated with a photoresist layer 103, which is irradiated with light in 1st pattern consisting of the border between an exposed area 111 and an unexposed area 112. Then the layer is irradiated with light in 2nd pattern consisting of the border between an exposed area 113 and an unexposed area 114 at an acute angle to the border part between the exposed area 111 and unexposed area 112 of the 1st pattern. Then a developing and a baking process are carried out to form a needlelike photoresist pattern having an acute-angle tip part and this pattern is used as a mask to etch the layer 102 to be etched.
Bibliography:Application Number: JP19910227367