SURFACE ACOUSTIC WAVE DEVICE

PURPOSE:To enable molding rich in moisture resistance by composing a package of a synthetic resin case covering a surface acoustic wave element and the integrated molding object of synthetic resin formed by a move forming method on the outer peripheral face. CONSTITUTION:This device is composed of a...

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Bibliographic Details
Main Authors SUZUKI ICHIRO, NAKANO HIROTOMO, FUKATSU TERUHIRO
Format Patent
LanguageEnglish
Published 12.03.1993
Subjects
BASIC ELECTRONIC CIRCUITRY
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
RESONATORS
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Summary:PURPOSE:To enable molding rich in moisture resistance by composing a package of a synthetic resin case covering a surface acoustic wave element and the integrated molding object of synthetic resin formed by a move forming method on the outer peripheral face. CONSTITUTION:This device is composed of a surface acoustic wave element 1, interdigital electrode part 2 formed on the surface acoustic wave element 1, synthetic resin case 3 equipped with hollow structure, synthetic resin case 6 formed by move formation to cover the entire synthetic resin case 3, and lead frame 5 fixing the surface acoustic wave element 1. Namely, the surface acoustic wave element 1 equipped with the interdigital electrode formed by the metal thin film of aluminium (A1) or aluminium alloy, etc., on the piezoelectric substrate of lithium niobate or lithium tantalate, etc., is first housed in the synthetic resin case 3. Then, this synthetic resin case has cap type structure composed of a base part 3b and a cap part 3a formed in advance.
Bibliography:Application Number: JP19910218436