MANUFACTURE OF ELECTRONIC PART AND APPARATUS FOR MANUFACTURING THE SAME

PURPOSE:To continuously realize a die bonding process, a wire bonding process and a mold process with a through line on the occasion of manufacturing an integrated circuit, etc., having a resin external package. CONSTITUTION:The manufacture comprises a die bonding process of bonding an integrated ci...

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Bibliographic Details
Main Authors TAKAHASHI TETSUO, MIYAUCHI EISAKU, ARAYA SHINICHI, MOGI KUNIO
Format Patent
LanguageEnglish
Published 12.03.1993
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To continuously realize a die bonding process, a wire bonding process and a mold process with a through line on the occasion of manufacturing an integrated circuit, etc., having a resin external package. CONSTITUTION:The manufacture comprises a die bonding process of bonding an integrated circuit chip to a lead frame 2 by a die bonder 4, a wire bonding process of connecting a bonding pad of the integrated circuit chip to a lead frame by a wire bonder 7, and a molding process of manufacturing a resin external package covering the integrated circuit chip by a resin molding apparatus. The die bonding process in which the lead frame is sent by a transporting means, wire bonding process and molding process are performed in this sequence.
Bibliography:Application Number: JP19910248274