THERMOSETTING RESIN COMPOSITION

PURPOSE:To obtain a thermosetting resin compsn. which is liquid without any solvent at ordinary temp. by using a liquid epoxy resin and a multivalent methylolalkylphenolic resin. CONSTITUTION:A thermosetting resin compsn. comprising a liquid epoxy resin and a multivalent methlolalkylphenolic resin,...

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Bibliographic Details
Main Authors FUJIKAWA YASUOKI, KITAJIMA HIDEKI
Format Patent
LanguageEnglish
Published 09.03.1993
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:PURPOSE:To obtain a thermosetting resin compsn. which is liquid without any solvent at ordinary temp. by using a liquid epoxy resin and a multivalent methylolalkylphenolic resin. CONSTITUTION:A thermosetting resin compsn. comprising a liquid epoxy resin and a multivalent methlolalkylphenolic resin, wherein the methylolalkylphenolic resin is one having at east 2 methylol groups per molecule and including at least 90% trimer or lower oligomers of an alkylphenol having a 5-9C alkyl group and at most 10% sum of unreacted alkylphenol monomer, monomethylolalkylphenol and tetramer and higher oligomers of the alkylphenol.
Bibliography:Application Number: JP19910244311