ELECTRONIC PARTS DEVICE

• Main Authors: MAKI NAOAKI, FUKATSU TERUHIRO, NAKANO HIROTOMO
• Format: Patent
• Language: English
• Published: 05.03.1993
• Subjects: BASIC ELECTRONIC CIRCUITRY; ELECTRICITY; IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS

PURPOSE:To obtain a plastic package having a simple production process and eliminating the necessity of an expensive metal mold or molding device by using a snap flit type plastic case for the plastic package. CONSTITUTION:A surface acoustic wave element is mounted on a lead frame with adhesives by a snap flit system and leads 6 are arranged so as to be joined with the recessed parts 3 of a cap 1. A base 4 is engaged with the cap 1 from the lower part and the cap 1 and the base 4 are tightly engaged with each other by applying several kg/cm pressure between the upper face of the cap 1 and the lower face of the base 4 to produce a united constitution product 7. Then the product 7 is dipped into epoxy resin in a metallic tank for 10 to 20 sec to form an epoxy layer with 1mm thickness on the whole outer surface of the product 7. The epoxy resin is heated by a heater so as to be held at a fixed temperature range of 25 to 50 deg.C to hold its viscosity at a fixed value. Then the resin is cured in a thermo-static oven for about one hour in the condition of 140 deg.C to produce a plastic package. Since the base 4 and the cap 1 are tightly stuck to each other, the inflow of the epoxy resin into a hollow part can be prevented.