MANUFACTURE OF PRINTED CIRCUIT BOARD

PURPOSE:To form a through hole of high reliability in a multilayer by coating a part to become a flexible part with a film cover lay, laminating a hard printed circuit board material on a part to become a multiplex part, and eliminating the lay on the multilayer. CONSTITUTION:Only a part to become a...

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Bibliographic Details
Main Author YAMAGUCHI CHIHIRO
Format Patent
LanguageEnglish
Published 26.02.1993
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PURPOSE:To form a through hole of high reliability in a multilayer by coating a part to become a flexible part with a film cover lay, laminating a hard printed circuit board material on a part to become a multiplex part, and eliminating the lay on the multilayer. CONSTITUTION:Only a part to become a flexible part 7 of a flexible printed circuit board material 1 is coated with a film cover lay 3 to protect an inner layer conductor pattern 2. A hard printed circuit board material 5 is laminated on a part to become a multilayer 6 of the material 1 through an insulating layer 4. After through holes are opened in place the multilayer 6, through holes 9 are formed by copper plating. The lay 3 does not exist on the multilayer 6 formed with the holes 9. Accordingly, a defect, etc., in the through hole generated due to adhesive of the lay 3, does not occur. Thus, the holes 9 of high reliability can be formed at the multilayer 6.
Bibliography:Application Number: JP19910202021