MANUFACTURE OF COPPER-CLAD LAMINATED BOARD FOR PRINTED WIRING

PURPOSE:To omit a polishing work by so superposing a polishing film on a surface of a copper foil that a polishing particle layer is brought into contact with the surface of the foil when the foil is extended on a prepreg resin laminated board, pressurized and hot pressed, and pressuring, and heat t...

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Bibliographic Details
Main Authors UEKI MASAYOSHI, KUBOTA KENJI
Format Patent
LanguageEnglish
Published 26.02.1993
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PURPOSE:To omit a polishing work by so superposing a polishing film on a surface of a copper foil that a polishing particle layer is brought into contact with the surface of the foil when the foil is extended on a prepreg resin laminated board, pressurized and hot pressed, and pressuring, and heat treating it. CONSTITUTION:A copper foil is superposed on one or both sides of a prepreg resin laminated board. Further, one side of an extrafine heat resistant film 3 made of polyester, polyimide film, etc., is coated with a high hardness polishing particle single layer or plural layers of heat resistant binder 2. The film 3 formed with predetermined uneven part on the surface is so superposed that the particle coating surface is brought into contact with the surface of the foil. After it is pressurized and heated through a mold by a press, the resin is cured, and then the film is peeled. Thus, the uneven part of the particle coating surface is transferred to the surface of the foil, and a fine and dense point-like uneven part having 1.0-10mum of Rmax is generated. Accordingly, a polishing work can be omitted.
Bibliography:Application Number: JP19910223724