METHOD AND APPARATUS FOR MOUNTING ELECTRONIC COMPONENT
PURPOSE:To provide a method and an apparatus for mounting an electronic component, which can flexibly cope with production of many types of products by automatically switching mounting data corresponding to the type of the product of a printed circuit board. CONSTITUTION:Data 7 representing a type o...
Saved in:
Main Authors | , |
---|---|
Format | Patent |
Language | English |
Published |
12.02.1993
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | PURPOSE:To provide a method and an apparatus for mounting an electronic component, which can flexibly cope with production of many types of products by automatically switching mounting data corresponding to the type of the product of a printed circuit board. CONSTITUTION:Data 7 representing a type of a product described on a printed circuit board 6 is read, and the data is collated with production plan data 31. Then, necessary data is extracted from mounting data 41 to mount an electronic component on the board 6. According to this method, even if the board is conveyed in any order, a production is performed without an operator. |
---|---|
Bibliography: | Application Number: JP19910275209 |