METHOD OF SOLDERING ELECTRONIC PARTS

PURPOSE:To see that plural kinds of electronic parts different in size can be soldered at the same time without adjusting the height of the quantity of applied cream solder. CONSTITUTION:This is characterized by having applied plural kinds of cream solders 1, 3, and 5 different in composition accord...

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Bibliographic Details
Main Author NAKAYAMA AKINORI
Format Patent
LanguageEnglish
Published 08.01.1993
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Summary:PURPOSE:To see that plural kinds of electronic parts different in size can be soldered at the same time without adjusting the height of the quantity of applied cream solder. CONSTITUTION:This is characterized by having applied plural kinds of cream solders 1, 3, and 5 different in composition according to the size of electronic parts 2, 4, and 6 on one printed board P.
Bibliography:Application Number: JP19910178939