CURABLE IMIDE OLIGOMER

• Main Authors: FURUYA HIROYUKI, IDA JIYUNYA
• Format: Patent
• Language: English
• Published: 03.12.1993
• Edition: 5
• Subjects: ACYCLIC OR CARBOCYCLIC COMPOUNDS; CHEMISTRY; COMPOSITIONS BASED THEREON; HETEROCYCLIC COMPOUNDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC CHEMISTRY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP

PURPOSE:To obtain a new curable imide oligomer industrially useful as laminate, heat-resistant coating compound, polymer material for electronic device, molding material, etc., having high heat resistance, excellent mechanical strength, dimensional stability, moisture resistance and processability. CONSTITUTION:A curable imide oligomer of formula I (Ar1 is tetrafunctional aromatic group; Ar2 is bifunctional aromatic group; X is group of formula II to formula IV; n is 0-15; R is substituent group having reactivity). A telechelic oligomer containing acid anhydride groups as both end groups among the oligomer is produced by dissolving compounds of formula V to formula VI (Y1 to Y4 are H or 1-5C alkyl; Ar is tetrafunctional aromatic group) in a polar organic solvent in a reactor in a sufficiently dried inert gas atmosphere such as argon or nitrogen and adding a compound of the formula H2N-Ar2-NH2 and/or a compound of formula VII (Ar3 is bifunctional organic group) as a solution dissolved in the same solvent or powder to the above-mentioned solution while taking care of heat generation or thickening.