CURABLE IMIDE OLIGOMER

PURPOSE:To obtain a new curable imide oligomer industrially useful as laminate, heat-resistant coating compound, polymer material for electronic device, molding material, etc., having high heat resistance, excellent mechanical strength, dimensional stability, moisture resistance and processability....

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Bibliographic Details
Main Authors FURUYA HIROYUKI, IDA JIYUNYA
Format Patent
LanguageEnglish
Published 03.12.1993
Edition5
Subjects
ACYCLIC OR CARBOCYCLIC COMPOUNDS
CHEMISTRY
COMPOSITIONS BASED THEREON
HETEROCYCLIC COMPOUNDS
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC CHEMISTRY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:PURPOSE:To obtain a new curable imide oligomer industrially useful as laminate, heat-resistant coating compound, polymer material for electronic device, molding material, etc., having high heat resistance, excellent mechanical strength, dimensional stability, moisture resistance and processability. CONSTITUTION:A curable imide oligomer of formula I (Ar1 is tetrafunctional aromatic group; Ar2 is bifunctional aromatic group; X is group of formula II to formula IV; n is 0-15; R is substituent group having reactivity). A telechelic oligomer containing acid anhydride groups as both end groups among the oligomer is produced by dissolving compounds of formula V to formula VI (Y1 to Y4 are H or 1-5C alkyl; Ar is tetrafunctional aromatic group) in a polar organic solvent in a reactor in a sufficiently dried inert gas atmosphere such as argon or nitrogen and adding a compound of the formula H2N-Ar2-NH2 and/or a compound of formula VII (Ar3 is bifunctional organic group) as a solution dissolved in the same solvent or powder to the above-mentioned solution while taking care of heat generation or thickening.
Bibliography:Application Number: JP19920155987