MANUFACTURE OF MULTILAYER CERAMIC CIRCUIT BOARD

• Main Authors: KAMEZAKI HIROSHI, IMANAKA YOSHIHIKO, WAKAMURA MASATO
• Format: Patent
• Language: English
• Published: 26.11.1993
• Edition: 5
• Subjects: ARTIFICIAL STONE; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CEMENTS; CERAMICS; CHEMISTRY; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS; CONCRETE; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LIME, MAGNESIA; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PRINTED CIRCUITS; REFRACTORIES; SLAG; TREATMENT OF NATURAL STONE

PURPOSE:To manufacture a board for high-speed signal by using a metal of low resistivity as wiring material and by using ceramics excellent in thermal conductivity. CONSTITUTION:AlN powder, Y2O3 powder, polyvinyl butyral, dibutyl phthalate and acetone are kneaded into slurry and formed into a green sheet by doctor blade method. Via is formed in the green sheet by the use of NC punching machine. Then, screen printing is performed by the use of W conductor paste so that the via 1 is filled up and a wiring pattern is printed. Four layers of this green sheet are aligned and laminated, thereafter formed into an integral body, and heated into a muitilayer ceramic circuit board. This multilayer board is immersed in H2O2 water so that a wiring composed of W is removed. The board is put in an alumina container filled with Cu powder and the container is set in an isostatic press so that the board is filled with Cu. After that, the board is taken out and polished so that excessive Cu adhering to the via is removed and board faces are smoothed.