JPH05299798

PURPOSE:To obtain an electronic circuit board which is free from cracks or the like and excellent in a circuit quality by using a metal composite material as the board. CONSTITUTION:An SiC whisker/Al board listed in Table 2 is used as a metal composite material (MMC). SiO2, which serves as an insula...

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Bibliographic Details
Main Authors FUJIWARA TSUTOMU, HABAKI NOBUO
Format Patent
LanguageEnglish
Published 12.11.1993
Edition5
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PERFORMING OPERATIONS
PRINTED CIRCUITS
TRANSPORTING
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Summary:PURPOSE:To obtain an electronic circuit board which is free from cracks or the like and excellent in a circuit quality by using a metal composite material as the board. CONSTITUTION:An SiC whisker/Al board listed in Table 2 is used as a metal composite material (MMC). SiO2, which serves as an insulation material is formed thereon by means of vacuum deposition where the Al in the matrix is a JIS7075-specified Al+2% Zn composition. Then, Cu, which is a first conductor layer, is formed on the insulation layer by vacuum deposition and a via hole is formed by etching; the conductor later Cu is further formed thereon by vacuum deposition and etched, thereby forming a circuit. The circuit comprising four conductor layers is formed by repeating this work. This construction makes it possible to reduce the difference of a coefficient of linear expansion with the insulation layer and inhibit a drop in insulation resistance and provide high heat emission properties and reduce thermal damages of components to be etched, such as IC.
Bibliography:Application Number: JP19910061592