JPH05235552

• Main Author: YAMAGUCHI CHIHIRO
• Format: Patent
• Language: English
• Published: 10.09.1993
• Edition: 5
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PURPOSE:To eliminate a defect due to separately mounting of a reinforcing plate by slotting unnecessary parts of two copper-plated hard plates, and laminating a reinforcing plate using a hard printed circuit board material for an outer layer. CONSTITUTION:A copper-plated hard plate 20 of a surface side of a flexible circuit board 1 remains at a part for forming a multilayer M and a predetermined length A of an end of a flexible part F. A copper-plated hard plate 30 of a rear surface side similarly remains at a part for forming a multilayer M and a length (A+L) from an end of a flexible part F, and the other parts are deleted. They are thermally press-bonded on the front and rear surfaces of the board 1 through adhesive sheets 4. A reinforcing plate 8 is simultaneously formed in the step of laminating hard printed circuit boards 2, 3 for forming the multilayer M. The plate 8 is cut at an end together with the part F by finish profile machining. An end of the plate 8 always coincides with that of the part F, and no adhering deviation occurs. No conduction between terminals and no damage of the part F due to the thermal press-bonding of the plate occur.