COPPER ELECTROPLATING SOLUTION

PURPOSE:To electroplate with good current efficiency a Cu plating film excellent in uniform electrical property and luster without defects, such as pinholes by using Cu plating solution having as essential components an organic compound contg. water soluble Cu compounds, a specified chelating agent...

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Main Authors NAWAFUNE HIDEMI, MIZUMOTO SHOZO, HAGA MASAKI, OKADA TAKASHI, UCHIDA HIROKO, UCHIDA MAMORU
Format Patent
LanguageEnglish
Published 07.09.1993
Subjects
APPARATUS THEREFOR
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
PRINTED CIRCUITS
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Summary:PURPOSE:To electroplate with good current efficiency a Cu plating film excellent in uniform electrical property and luster without defects, such as pinholes by using Cu plating solution having as essential components an organic compound contg. water soluble Cu compounds, a specified chelating agent and divalent S. CONSTITUTION:As essential components of Cu electroplating solution, copper sulfate, copper chloride, copper oxide, copper carbonate, copper acetate, etc., in concentration of 0.01-1mol/l, at least one of organic compounds represented by the formula I, II, III as a chelating agent for forming complex of the Cu compounds in concentration of 0.01-2mol/l and divalent S contg. organic compounds, such as disulfides and thiazoles in concentration of 0.1-500mg/l are included in water solution. And in the water solution, if necessary, at least one of N contg. compounds represented by the formula IV, V as a deposited Cu film ductility improving agent in concentration of 0.006-1mol/l, further halide or sulfate of alkali metal in concentration of 0.01-3mol/l and a surfactant or polyacrylamide are included.
Bibliography:Application Number: JP19920031932