PALLADIUM-BASE ELECTROLESS PLATING SOLUTION

• Main Authors: NAWAFUNE HIDEMI, MIZUMOTO SHOZO, HAGA MASAKI, OKADA TAKASHI, UCHIDA HIROKO, UCHIDA MAMORU
• Format: Patent
• Language: English
• Published: 24.08.1993
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PURPOSE:To obtain the highly stable plating soln. by which the physical properties. appearance, etc., of the deposited film are improved, the film is hardly pitted even if the soln. is not agitated and the film is uniformly electrodeposited. CONSTITUTION:This electroless palladium-nickel alloy plating soln. consists of an aq. soln. contg. 0.0001-0.5mol/l of a palladium compd., 1-500mg/l of an org. compd. contg. bivalent sulfur, 0.01-5g/l of a surfactant, 0.001-8mol/l of at least one kind between ammonia and an amine compd. and (d) 0.005-2mol/l of at least one kind among a phosphite, a hypophosphite and boron hydride or 0.001-1mol/l of a nickel compd. and 0.005-2mol/l of at least one kind between the hypophosphite and boron hydride instead of (d).