METHOD FOR JOINING COPPER SHEET TO ALUMINA OR ALN SUBSTRATE

• Main Authors: NAKANO TADASHI, KANAMARU TAKAO, KUMAGAI MASATO, FUKUDA KENJI
• Format: Patent
• Language: English
• Published: 24.08.1993
• Subjects: ARTIFICIAL STONE; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CEMENTS; CERAMICS; CHEMISTRY; CLADDING OR PLATING BY SOLDERING OR WELDING; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS; CONCRETE; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LIME, MAGNESIA; MACHINE TOOLS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; METALLURGY; PERFORMING OPERATIONS; PRINTED CIRCUITS; REFRACTORIES; SLAG; SOLDERING OR UNSOLDERING; TRANSPORTING; TREATMENT OF NATURAL STONE; WELDING; WORKING BY LASER BEAM

PURPOSE:To prevent defective joining by using a copper sheet contg. a specified amt. or less of oxygen when a copper sheet is joined to an alumina or AlN substrate with a brazing filler metal contg. an active metal. CONSTITUTION:A copper sheet is heat-treated at about 850-950 deg.C in a vacuum of <=10<-5>Torr to prepare a copper sheet contg. <=15ppm oxygen. A brazing filler metal contg. an active metal such as Ti, Zr or Hf, e.g. a Ti-Ag-Cu brazing filler metal is interposed between an alumina or AlN substrate and the prepd. copper sheet and they are joined by heat treatment at about 850 deg.C for about 30min in a vacuum of <=10<-5>Torr. This method is applicable to the joining of a copper sheet to a substrate of other oxide or nitride ceramics.