MANUFACTURE OF POLYIMIDE MULTILAYER WIRING BOARD

PURPOSE:To prevent the generation of contact isolation in a post-process by composing a solder pool of multilayer plating, in which different metallic layers are superposed alternately, and constituting a section brought into contact with said solder pool of one or more of metals organizing the sold...

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Bibliographic Details
Main Author KANEHARA KOJI
Format Patent
LanguageEnglish
Published 13.08.1993
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To prevent the generation of contact isolation in a post-process by composing a solder pool of multilayer plating, in which different metallic layers are superposed alternately, and constituting a section brought into contact with said solder pool of one or more of metals organizing the solder pool in a metallic bump. CONSTITUTION:Bumps 7 for connection are patterned through photolithography using a photo-resist, and formed by the two-layer plating of electrolytic nickel plating and electrolytic gold plating. Solder pools 17 are patterned through photolithography employing the photo-resist, and electrolytic nickel plating in 3mum thickness is formed. Electrolytic tin plating and electrolytic gold plating are conducted alternately, and the multilayer plating of gold and tin is formed. A polyimide layer with the metallic bumps 7 for connection and a polyimide multilayer interconnection layer with the solder pools 17 are aligned and superposed, and mutual polyimide films are bonded and fixed through pressing and heating up to a temperature exceeding the glass transition point of a polyimide resin.
Bibliography:Application Number: JP19910301430