REDUCING AGENT

PURPOSE:To provide a reducing agent which is used for reducing an oxide layer at the surface of copper to metallic copper in bonding copper to a resin. CONSTITUTION:A reducing agent which contains at least one compd. selected from the group consisting of compds. of the general formula: BH3.NHRR'...

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Bibliographic Details
Main Authors WAJIMA MOTOYO, FURUKAWA KIYONORI, TOBA RITSUJI, SHIMAZAKI TAKESHI, AKABOSHI HARUO, MURAKAMI KANJI
Format Patent
LanguageEnglish
Published 03.08.1993
Subjects
ADHESIVES
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
DYES
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
POLISHES
PRINTED CIRCUITS
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Summary:PURPOSE:To provide a reducing agent which is used for reducing an oxide layer at the surface of copper to metallic copper in bonding copper to a resin. CONSTITUTION:A reducing agent which contains at least one compd. selected from the group consisting of compds. of the general formula: BH3.NHRR' (wherein R and R' are each H, CH3, or CH2CH3) is provided. Using the agent enables copper to be bonded to a resin with good results without the problem of corrosion by acid before and after bonding.
Bibliography:Application Number: JP19920169699