SEMICONDUCTOR MANUFACTURING APPARATUS

PURPOSE:To enhance the uniformity of the thickness of the coating film of a photoresist onto a wafer and to reduce mistlike foreign bodies of the resist. CONSTITUTION:The title apparatus is constituted in the following manner: a resist nozzle 1 which drops a photoresist onto a wafer 2 can be moved,...

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Bibliographic Details
Main Author TAKAYAMA KENJI
Format Patent
LanguageEnglish
Published 30.07.1993
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To enhance the uniformity of the thickness of the coating film of a photoresist onto a wafer and to reduce mistlike foreign bodies of the resist. CONSTITUTION:The title apparatus is constituted in the following manner: a resist nozzle 1 which drops a photoresist onto a wafer 2 can be moved, by means of a motor 6, from the center of the water 2 to the periphery of the wafer 2; and the distance 4 between the wafer 2 and the resist nozzle 1 can be changed by means of a cam 7 for nozzle raising and lowering use.
Bibliography:Application Number: JP19920002958