SPUTTERING DEVICE

• Main Authors: TAKAHASHI SHUNJI, KASE KAZUTO, HARA ISAO, HONDA YUJI, KURATANI TOSHIO, SUZUKI MITSUHIRO
• Format: Patent
• Language: English
• Published: 09.07.1993
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PURPOSE:To reduce the installing space of a sputtering device and to execute a uniform treatment even if the size of a sample is large. CONSTITUTION:One edge part of housing 1 is provided with a preparing chamber 3 and a discharging chamber 4 via valves 2, and plural carriers respectively fitted with a sample such as a glass sheet can be housed in the preparing chamber 3 and discharging chamber 4. The housing 1 is provided with a pressure reducing pipe 6 connected to a vacuum pump and an introducing pipe 7 of reaction gas. Its inside is provided with two linear carrier conveying lines L1 and L2 parallel and these carrier conveying lines L1 and L2 are connected by transferring lines L1 and L2 provided on the edge parts in the housing 1 to constitute a circulating line. The side walls of the housing 1 along the carrier conveying lines L1 and L2 are provided with cathode electrodes 8, targets 9 are fitted to the cathode electrodes 8, and furthermore, heaters 10 are arranged along the inside of the carrier conveying lines L1 and L2.