MANUFACTURING METHOD OF WIRING BOARD

• Main Authors: NAKASO AKISHI, HATAKEYAMA SHUICHI, KIDA AKINARI, URASAKI NAOYUKI, TSUYAMA KOICHI
• Format: Patent
• Language: English
• Published: 02.07.1993
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PURPOSE:To manufacture the title wiring board without disconnecting a line around a through hole by a method wherein a thin metallic copper layer formed of an insulating material is etched away with excellent precision. CONSTITUTION:After the formation of a copper oxide layer 2 on a copper foil 1, a...