MANUFACTURING METHOD OF WIRING BOARD

• Main Authors: NAKASO AKISHI, HATAKEYAMA SHUICHI, KIDA AKINARI, URASAKI NAOYUKI, TSUYAMA KOICHI
• Format: Patent
• Language: English
• Published: 02.07.1993
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PURPOSE:To manufacture the title wiring board without disconnecting a line around a through hole by a method wherein a thin metallic copper layer formed of an insulating material is etched away with excellent precision. CONSTITUTION:After the formation of a copper oxide layer 2 on a copper foil 1, an insulating base material 3 is arranged and then heat-pressurized to be turned into a laminated body structure. Successively, after making a through hole, the copper foil 1 is removed so as to reduce the copper oxide layer 2 to an ultrathin copper foil 5. This structure with a plating catalyst bonded onto the surface thereof is immersed in a non-electrolytic plating solution to form a non-electrolytic plating layer 7. Next, a dry film resist is laminated on the surface of this non-electrolytic plating layer 7 to be exposed and developed for the formation of a plating resist image 8. Later, electroplating is conducted to form a pattern copper plating layer 9. A copper oxide layer 10 formed after releasing the plating resist 8 is removed by immersing it into a sulfuric acid solution to be turned into the title wiring board. Through these procedures, a fine wiring can be formed without thinning or disconnecting the copper wiring.