PRINTED WIRING BOARD

PURPOSE:To enhance a printed wiring board in soldering reliability by a method wherein solder bridges are prevented from occurring between mounting lands. CONSTITUTION:A printed wiring board 11 is provided with an insertion hole 12 where a lead terminal of a component such as an IC or the like is in...

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Bibliographic Details
Main Author SAOTOME TOSHIO
Format Patent
LanguageEnglish
Published 25.05.1993
Subjects
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Summary:PURPOSE:To enhance a printed wiring board in soldering reliability by a method wherein solder bridges are prevented from occurring between mounting lands. CONSTITUTION:A printed wiring board 11 is provided with an insertion hole 12 where a lead terminal of a component such as an IC or the like is inserted and a mounting land 13 provided around the insertion hole 12, where solder bridge preventing parts 15 are provided to, at least, one of the mounting lands 13 provided adjacent to each other.
Bibliography:Application Number: JP19910290290